High viscosity and filler sedimentation
模塑/灌封
Key Challenges in Molding / Potting
Air entrapment and void formation
Ratio deviation in two-component systems
Uneven filling in deep cavities or narrow gaps
High-Performance Potting System

NEXGEN’s molding and potting system is designed for accurate mixing, stable dispensing, and clean filling of highly viscous one- and two-component materials. The system integrates servo-driven metering pumps, dynamic mixing heads, and vacuum-assisted feed units to ensure homogeneous mixing and void-free encapsulation. With temperature-controlled material handling, it provides precise control over shot volume and flow rate under continuous production conditions, ensuring:
- Consistent ratio accuracy and uniform material mixing
- Bubble-free potting with complete cavity filling
- Clean, repeatable dispensing with minimal waste
- Stable, energy-efficient operation aligned with ESG and sustainability goals
Molding / Potting Applications in Typical Industries
PCB, Sensors, and Power Modules
Encapsulation of electronic assemblies for protection against moisture, vibration, and heat.
Ignition Coils, Control Units, and Connectors
Potting of under-the-hood components to ensure insulation and mechanical stability under harsh conditions.
Drivers and Housings in LED Lighting
Encapsulation for waterproofing and thermal management in indoor and outdoor LED modules.
Power Converters and Cells
Potting and sealing of converters and energy storage systems for improved heat dissipation and durability.
Coils, Transformers, and Control Boards
Encapsulation of electrical components for long-term performance and environmental protection.