模塑/灌封

In electronic and automotive manufacturing, molding and potting are essential for protecting sensitive components from moisture, vibration, and thermal stress. Proper encapsulation can extend component lifespan by up to 3–5 times and reduce failure rates by over 60%. Using materials such as epoxy, polyurethane, and silicone, potting ensures durability, insulation, and structural integrity for PCBs, sensors, coils, and connectors. Because these compounds are highly viscous and filler-loaded, they demand precise ratio control, thorough mixing, and bubble-free dispensing to achieve complete coverage and long-term reliability.

Key Challenges in Molding / Potting

High viscosity and filler sedimentation

Air entrapment and void formation

Ratio deviation in two-component systems

Uneven filling in deep cavities or narrow gaps

High-Performance Potting System

NEXGEN’s molding and potting system is designed for accurate mixing, stable dispensing, and clean filling of highly viscous one- and two-component materials. The system integrates servo-driven metering pumps, dynamic mixing heads, and vacuum-assisted feed units to ensure homogeneous mixing and void-free encapsulation. With temperature-controlled material handling, it provides precise control over shot volume and flow rate under continuous production conditions, ensuring:

  • Consistent ratio accuracy and uniform material mixing
  • Bubble-free potting with complete cavity filling
  • Clean, repeatable dispensing with minimal waste
  • Stable, energy-efficient operation aligned with ESG and sustainability goals

Molding / Potting Applications in Typical Industries

PCB, Sensors, and Power Modules

PCB, Sensors, and Power Modules

Encapsulation of electronic assemblies for protection against moisture, vibration, and heat.

Ignition Coils, Control Units, and Connectors

Ignition Coils, Control Units, and Connectors

Potting of under-the-hood components to ensure insulation and mechanical stability under harsh conditions.

Drivers and Housings in LED Lighting

Drivers and Housings in LED Lighting

Encapsulation for waterproofing and thermal management in indoor and outdoor LED modules.

Power Converters and Cells

Power Converters and Cells

Potting and sealing of converters and energy storage systems for improved heat dissipation and durability.

Coils, Transformers, and Control Boards

Coils, Transformers, and Control Boards

Encapsulation of electrical components for long-term performance and environmental protection.

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