Material separation and inconsistent flow
1K/2K Adhesive Bonding Solution
Key Challenges in 1K/2K Adhesive Dispensing
High viscosity and filled materials
Inconsistent dispense accuracy
Off-ratio 2K material mixing
High-Precision Mixing & Dispensing System

NEXGEN’s high-precision mixing and dispensing systems are engineered to handle the toughest adhesive materials, especially high-viscosity and filler-loaded 1K/2K compounds. Our systems maintain precise flow control and ratio accuracy through closed-loop feedback. Designed to minimize material separation and eliminate off-ratio mixing, our system ensure consistent, homogeneous output and stable performance for critical sealing and bonding applications.
Related Products
Bonding Applications in Typical Industries
Cell-to-cell and module bonding
Applying 2K polyurethane/epoxy adhesives between cylindrical, prismatic or pouch cells to maintain pack rigidity and insulation.
Component bonding and PCB assembly
Dispensing micro-dots or fine beads of adhesives (UV, epoxy, silicone) for attaching small components, flex cables, connectors and sensors on printed circuit boards.
Wood and furniture assembly bonding
Applying 1K/2K polyurethane, epoxy, or PVAc adhesives to bond wooden components in furniture and interior manufacturing, offering clean joints & strong adhesion.
Composite-to-metal and interior panel bonding
Using toughened epoxy or MMA adhesives to join composite panels to metal frames in aerospace, rail, or high-end vehicle structures.
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